Optoscribe at OFC 2018
The Optoscribe team are excited to be attending the Optical Fiber Communication Conference and Exhibition in San Diego Convention Center from 11 to 15 March. The OFC Conference is the world's leading global conference and exposition for optical communications and networking professionals.
As data rates increase to 400G and beyond, to meet the growing demand for online content, SiPh based transceiver designs are becoming more popular. However, low loss, efficient coupling of the fiber to the SiPh chip has been a substantial challenge. Optoscribe will explain how its advanced coupling solutions provide an efficient and scalable way of transferring light in and out of SiPh chips, helping manufacturers to overcome this challenge.
Also being demonstrated is the Company’s new Optical Sub-Assembly (OSA) for VCSEL or DFB based 400G transceiver architectures. More functionality is added to existing glass-based integrated photonic components to help alleviate packaging constraints and improve performance. This includes depositing metallisation layers for electrical tracking, embedding through-glass-vias (TGVs) and using the glass as a substrate for the active components such as drivers, laser arrays and photodetector arrays.
Please come along and visit Optoscribe at Booth 6230.