Optoscribe at SPIE Photonics West 2019 2nd -7th February, 2019
The SPIE Photonics West Conference is the world’s largest photonics technologies event, consisting of three conferences and two exhibitions.
Optoscribe CEO, Nick Psaila, will present a talk on 3D laser direct writing for advanced photonic integration in optical communications. The persistent drive for increased bandwidth while simultaneously reducing cost in short range optical communications systems is placing substantial pressure on component manufacturers to increase the level of integration and adopt lower cost assembly processes. Moving to well established processes used widely in the electronics industry, such as wafer scale test and assembly and high-speed vision-based alignment, is a key step to satisfying this demand.
Ultrafast lasers offer a unique tool for the integration of photonic components. Nick will discuss how they can be used for manufacturing glass-based interconnect components, which are applied to both fiber-fiber and fiber-transceiver applications. He will show how these components can be used as optical interfaces or further combined with conventional lithographic processes to help solve challenges in the packaging of photonic components. Nick will also show how these components can be used as an integration platform for optical sub-assemblies and photonic-electronic interposers.