OPTOSCRIBE DEMONSTRATES ITS LATEST ADVANCED FIBER COUPLING AND OPTICAL SUB-ASSEMBLY TECHNOLOGY AT OFC 2018
LIVINGSTON, UK – 8 March, 2018 – Optoscribe a global supplier of glass-based integrated photonic components will be showcasing its new comprehensive suite of fiber coupling solutions for Silicon Photonics (SiPh) alongside its Optical Sub-Assembly platform for VCSEL and DFB based hybrid transceiver designs at the 2018 Optical Fibre Communication Conference and Exhibition in San Diego Convention Centre from 13th to 15th March. Please come along and visit Optoscribe at Booth 6230.
As data rates increase to 400G and beyond, to meet the growing demand for online content, SiPh based transceiver designs are becoming more popular. However, low loss, efficient coupling of the fiber to the SiPh chip has been a substantial challenge. Optoscribe will explain how its advanced coupling solutions provide an efficient and scalable way of transferring light in and out of SiPh chips, helping manufacturers to overcome this challenge.
Also being demonstrated is the Company’s new Optical Sub-Assembly (OSA) for VCSEL or DFB based 400G transceiver architectures. More functionality is added to existing glass-based integrated photonic components to help alleviate packaging constraints and improve performance. This includes depositing metallisation layers for electrical tracking, embedding through-glass-vias (TGVs) and using the glass as a substrate for the active components such as drivers, laser arrays and photodetector arrays.
Nick Psaila, Chief Executive Officer of Optoscribe said: “We are delighted to showcase our latest technology developments that deliver higher levels of integrated photonic components for transceiver manufacturers.
“With greater levels of optical and electrical integration, at wafer scale level, we aim to be the photonic integration partner of choice for next generation transceivers.”