Optical Sub-Assembly (OSA) Platform
Building on its unique 3D glass-based photonic integrated circuit platform, Optoscribe has developed a full OSA platform for hybrid (VCSEL and DFB) transceivers. The Company’s 3D glass platform with fully integrated waveguides, mirrors and V-grooves acts as a substrate with metallization and polyimide layers deposited on the surface of the glass chip, using well proven CMOS lithographic processes, to create electrical circuitry on the surface of the glass.
Surface mounted components, including VCSELs, DFBs, photodiodes, driver ICs and TIAs can be flip-chipped reliably and inexpensively onto the electrical layer. This approach facilitates wafer scale assembly for cost-effective, high volumes, high yields and alleviates some of the manufacturing challenges.
Optical Sub-Assembly (OSA)
The OSAs are manufactured and assembled at wafer level including the laser inscribed waveguides, microstructures such as mirrors and V-grooves, TGV creation, metallization and polyimide layer deposition and active component mounting. Precision throughglass-
vias (TGVs) are fabricated in the glass using Optoscribe’s laser induced etch rate enhancement process to create precisely positioned holes in the glass to enable electrical connectivity between the top and bottom surfaces. Glass is an excellent dielectric and ideally suited for hosting and embedding electrical signal paths such as those in the TGVs. This results in low-loss and improved cross talk signal performance, particularly at high frequencies. The OSA is then mounted onto a carrier PCB without the need for wire bonds or flex circuits.
As data rates increase, channel count will multiply in transceivers resulting in higher density configurations. This single OSA approach simplifies the integration, packaging, performance and assembly cost challenges for the transceiver manufacturers.