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Multicore fiber (MCF) has the potential to dramatically increase data bandwidth in networks and systems, particularly in application areas where cable density is critical. Every run of MCF requires a fanout device to enable access (connection with) each of the single mode cores.  Optoscribe’s 3D OptoFan™ is a series of glass components designed to interface MCFs and single mod ...

Earlier this year, Optoscribe launched OptoArray™, its new range of best-in-class precision fiber alignment structures, which can solve many of the challenges with the drive for high density optical connections. OptoArray™ is now in volume production with a major player in the optical switch market and is gaining traction with other major customers in the Optical Cross Connect ...

The Covid-19 pandemic is affecting all business organisations worldwide including Optoscribe. We are carefully monitoring UK government advice and are doing everything we can to minimise the impact this outbreak has on our employees and customers. Our thoughts are with all those affected. As present, our manufacturing facility in Scotland, UK, is still fully operational. We a ...

We are pleased to announce that we have joined PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line.  PIXAPP consists of a highly interdisciplinary team of Europe’s leading industrial and research organisations, and provides users with single-point access to PIC assembly and packaging. It provides the full range of assembly ...

The Optoscribe team is looking forward to attending the 45th European Conference on Optical Communication (ECOC) in Dublin, Ireland from 22nd-26th September 2019. ECOC is Europe’s largest exhibition dedicated to fiber optic communication technology, attracting over 6,500 decision-makers from across the industry. During the exhibition, Optoscribe will showcase its latest advan ...

Optoscribe CEO Nick Psaila will deliver a talk at the 31st Annual Electronics Packaging Symposium on 3D laser written glass components for advanced photonic packaging.  The Symposium, held at the GE Research Center in Niskayuna, New York, brings together leaders in academia, industry and government to discuss electronics packaging topics including 2.5/3D packaging; mm wave in ...

The Optoscribe team will be attending the PIC International Conference in Brussels, Belgium from 26th-27th March 2019. The PIC International Conference attract experts from across the integrated photonics industry, with over 600 industry innovators, 70 exhibitors, 5 key themes and over 30 presentations, including one from Nick Psaila, CEO at Optoscribe, on 3D laser written gl ...

The Optoscribe team are looking forward to attending the Optical Fiber Communication (OFC) Conference in San Diego from 3rd -7th March 2019. OFC is the world’s largest global conference and exhibition for optical communications and networking professionals.  During the conference, Optoscribe and Corning will showcase their joint collaboration DIRECT CONNECT Platform, and Optos ...

The SPIE Photonics West Conference is the world’s largest photonics technologies event, consisting of three conferences and two exhibitions.  Optoscribe CEO, Nick Psaila, will present a talk on 3D laser direct writing for advanced photonic integration in optical communications.  The persistent drive for increased bandwidth while simultaneously reducing cost in short range opti ...

The DIRECT CONNECT platform facilitates the passive and direct connection of Optoscribe's unique glass based 3D photonic integrated circuits to single fiber LC and multi-fiber MPO connectors, such as the MTP® brand connectors, without the need for a fiber stub or jumper. Corning has developed custom designed adaptors facilitating LC and MTP® connector mating. Optoscribe's 3D ...