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Optoscribe at PIC 2018

Over the last two days the Optoscribe team joined over 550 innovators from the integrated photonics industry in Brussels. The conference was enlightening and confirmed that Optoscribe's latest technology - SiPh Advanced Coupling Solutions and Optical Sub-Assembly (OSA) platform will be key building blocks at a wafer-scale level bringing together electronics and photonics for optical interconnects in hyper data centers. It was really interesting to hear from Facebook that the demand for online content is driving bandwidth growth in data centers that will fuel innovation in both technology and manufacturing processes - two key areas being addressed by Optoscibe's new technology.

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