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Optoscribe joins PIXAPP

We are pleased to announce that we have joined PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line. 

PIXAPP consists of a highly interdisciplinary team of Europe’s leading industrial and research organisations, and provides users with single-point access to PIC assembly and packaging. It provides the full range of assembly and integration technologies needed to package multifunctional PIC devices, across all stages of manufacturing. 

PIXAPP bridges the gap often associated with moving from prototyping to fabrication, by helping to transfer R&D results to the market. Its broad technology offering ensures that users have a single facility wherein they can find the technologies and expertise needed to support their full packaging requirements. 

For more information about PIXAPP, visit:

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