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Optoscribe at the 31st Annual Electronics Packaging Symposium 2019, 5th-6th September 2019

Optoscribe CEO Nick Psaila will deliver a talk at the 31st Annual Electronics Packaging Symposium on 3D laser written glass components for advanced photonic packaging. 

The Symposium, held at the GE Research Center in Niskayuna, New York, brings together leaders in academia, industry and government to discuss electronics packaging topics including 2.5/3D packaging; mm wave in packaging; automotive & harsh environments; bioelectronics; flexible & additive electronics; materials for packaging & energy store; MEMS; photonics; power electronics; sensors; embedded electronics & IoT; thermal challenges; and wearable & flexible electronics for medical applications.

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