Find our latest White Papers below:
Abstract - For optical systems designers, the co-efficient of thermal expansion (CTE) mismatches can cause headaches when developing and qualifying products over the full temperature ranges required for consumer and industrial applications. Typically, products need to demonstrate endurance over -40˚C to 85˚C, under high humidity with both steady state and cyclic temperature profiles. By using assemblies and alignment structures well thermally matched to optical fibers, one of the potential failure mechanisms during qualification can be reduced or mitigated.
Abstract - Just as the semiconductor industry is struggling with demands to pack transistors on chips at densities previously thought to be impossible, the fiber optics industry is grappling with the need for ever higher capacity data transmission. A key difficulty in this task is accurately connecting large numbers of often densely packed fibers to the next link in the chain. 2D hole arrays manufactured using laser-induced selective etching offers the ideal solution.
Abstract - The demand for ever increasing bandwidth is driving the need for dense optical fiber connections in applications such as datacenter interconnects and optical switching nodes. Many of these high-density connections require the use of precise, tightly-toleranced fiber alignment structures to accurately position the optical ports. While many solutions exist to create low fiber count and/or one-dimensional fiber arrays, making 2D arrays of high channel count (greater than 32 channels) is more complex.
Abstract: A perfect storm of factors is driving data center operators and transceiver manufacturers to search for novel solutions that can address fiber-to-SiPh chip coupling challenges.
Abstract - Just as the semiconductor industry is struggling with demands to pack transistors on chips at densities previously thought impossible, the fibre optics industry is grappling with the need for ever higher capacity data transmission. A key difficulty in this task is accurately connecting large numbers of often densely packed fibres to the next link in the chain. 2D hole arrays manufactured using laserinduced selective etching offer the ideal solution.
Abstract - With ever-increasing fiber density presenting challenges for optical switching manufacturers, novel fiber alignment solutions are needed to avoid optical losses without costs spiralling.
Abstract - The demand for ever increasing bandwidth is driving the need for dense fiber optical connections in applications such as datacentre interconnects and optical switching nodes. Many of these high-density connections require the use of precise, tightly toleranced fiber alignment structures to accurately position the optical ports. While many solutions exist to create one-dimensional arrays of optical fibers such as v-groove arrays, making 2D arrays of optical fibers is more complex.
Abstract - Single mode transceiver manufacturers face a tough task in producing ever faster devices at lower cost that assist data centre operators in tackling the data deluge. Yet the crucial component linking optical signals to the electronics within the transceiver, requires some new approaches to meet this challenge.
Abstract - The demand for bandwidth within datacenters has never been greater, with the drive for the next generation of transceiver modules resulting in the need for increased channel count and/or data rates per channel. As transceiver manufacturers develop designs for 400Gb/s and beyond, the already challenging task of fabricating and assembling is becoming even more complex in order to meet the optical and electrical performance requirements demanded by datacenter operators.
Abstract - As a technique to manufacture waveguides and micromachined optical structures in glass, laser inscription may not be as well-established as photolithography, but it offers advantages that align with the needs of optical transceiver manufacturers.
Abstract - Data center operators are pushing transceiver manufacturers to deliver ever increasing performance levels at lower costs, targeting 400Gb/s optical transceivers at a sale price of $1 per Gb/s by 2019. To meet this challenge, significant innovation is needed in integrated design, assembly and packaging of optical interconnects, particularly in single mode transceivers which are becoming more common as data-center operators adopt more unified architectures.
Abstract - Ethernet speed increases from 10G, 40G, 100G and now to 400G have been designed to satisfy the ever-increasing demand for higher bandwidth from consumer markets as traffic volumes explode with more and more cloud computing applications and services. The need to deliver content to a myriad of devices efficiently has the full attention of data center operators and drives the journey to 400G and beyond.