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Optoscribe has developed a suite of photonic capabilities, combining a range of building blocks including 3D waveguides, precision alignment features and micro-optic components.

The Company’s technology uses laser-based manufacturing to directly write optical waveguide circuits and micromachined structures into glass substrates. Integrating microstructures with waveguides and optical components provides new possibilities in applications such as fiber coupling, and a significant relaxation of design constraints in terms of layout, assembly and packaging.

These compact glass-based 3D photonic components are manufactured in-house by Optoscribe using the Company’s high-speed wafer-scale production lines.

CTO and Co-Founder, Dr Nick Psaila, introduces Optoscribe and its innovative technology platform:




Optoscribe’s core manufacturing technology uses ultrashort pulsed lasers to directly write photonic structures within the substrate.  By tightly focussing the laser inside the target material, multi-photon absorption of the laser light can be induced, resulting in highly localised structural modification to the substrate which can be accurately placed deep within the glass.  The form of modification can be tuned by altering the process conditions within the laser machine.

One form of modification that can be induced is a change to the refractive index. By rapidly scanning the laser beam with respect to the substrate, 3D waveguide circuits can be formed.

Wafer scale fabrication of 3D waveguides.

Another form of modification that can be induced is a change to the etch rate of the glass. This allows for 3D micromachining of the substrate by a two-step process of laser irradiation followed by chemical etching. This technique allows for a greater level of flexibility in the form and shapes that are possible when compared to mask-based etching or laser ablation.

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High channel count OptoArray™ formed using Optoscribe’s 3D Micromachining process.




3D Waveguides

Flexible freeform 3D routing

Optoscribe’s unique 3D waveguide platform enables an unprecedented degree of freedom in waveguide circuit design, enabling new device possibilities.

  • Robust single and multimode waveguides
  • High positional accuracy
  • Low propagation losses
  • High coupling efficiency to standard single mode fibers
  • Low polarisation dependent losses
  • Polarisation maintaining capability
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Wafer scale fabrication of 3D waveguide circuits.

3D Micromachining

Highly flexible freeform 3D structures

Optoscribe’s wafer-scale 3D Micromachining process enables high quality sub-micron precision microstructuring for a range of structures including precision mechanical alignment features, micro-optics and fiducial marks.

  • High accuracy (<0.5 um)
  • Full 3D design freedom
  • Suitable for high accuracy single mode fiber positioning applications

For more information on OptoArray™ precision fiber alignment arrays please click here.


OptoArray™ precision fiber alignment structure.

  • Passive alignment features such as V-grooves
  • High precision optical surfaces for micro-optics such as curved mirrors
  • Precision fiducial marks for vision-based alignment

For more information on OptoCplrLT™ Fiber-to-SiPh Coupling, please click here.


OptoCplrLT™ - focussing mirrors for coupling to SiPh grating couplers.





Optical Coupling Solutions for Co-packaged Optics (CPO) Applications.

Optoscribe CTO and Co-Founder Dr Nick Psaila presents an overview of Optical Coupling solutions for Co-packaged Optics (CPO) Applications:

Fiber Connectivity

High performance fiber alignment

Precise positioning of arrays of optical fibers, such as precision hole plates, V-groove arrays or connector ferrules.

For more information on OptoArray™ precision fiber alignment arrays please click here.

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Micromachined precision V-groove array base.

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Populated fiber V-groove array.

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OptoArray™ - 2x12 glass MT Ferrule Insert.

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High port count OptoArray™ in 2 mm thick substrate.


Freeform 3D routing

3D waveguide devices to facilitate low-loss coupling between fiber configurations such as multicore fiber fan-in / fan-outs, photonic lanterns for multimode to single mode coupling and fiber shufflers.

For more information on OptoFan™ multicore fiber fanout, please click here.


OptoFan™ multicore fiber fanout


High performance optical interfaces

Efficient coupling between optical fiber and the active elements in the transceiver, such as light turn fiber arrays for silicon photonics grating coupler interfacing.

For more information on OptoCplrLT™ Fiber-to-SiPh Coupling, please click here.

Photonic integration platforms

Active & passive integration

Glass integration platforms for PIC integration, from simple optomechanical substrates to electronic and photonic interposers suitable for flip-chip assembly of active components.

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Example multimode Optical sub-assembly.


Copper-filled through-glass-vias (TGVs).